Semicera presents the industry-leading Wafer Carriers, engineered to provide superior protection and seamless transportation of delicate semiconductor wafers across various stages of the manufacturing process. Our Wafer Carriers are meticulously designed to meet the stringent demands of modern semiconductor fabrication, ensuring the integrity and quality of your wafers are maintained at all times.
Key Features:
• Premium Material Construction: Crafted from high-quality, contamination-resistant materials that guarantee durability and longevity, making them ideal for cleanroom environments.
• Precision Design: Features precise slot alignment and secure holding mechanisms to prevent wafer slippage and damage during handling and transportation.
• Versatile Compatibility: Accommodates a wide range of wafer sizes and thicknesses, providing flexibility for various semiconductor applications.
• Ergonomic Handling: Lightweight and user-friendly design facilitates easy loading and unloading, enhancing operational efficiency and reducing handling time.
• Customizable Options: Offers customization to meet specific requirements, including material choice, size adjustments, and labeling for optimized workflow integration.
Enhance your semiconductor manufacturing process with Semicera’s Wafer Carriers, the perfect solution for safeguarding your wafers against contamination and mechanical damage. Trust in our commitment to quality and innovation to deliver products that not only meet but exceed industry standards, ensuring your operations run smoothly and efficiently.
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Items |
Production |
Research |
Dummy |
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Crystal Parameters |
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Polytype |
4H |
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Surface orientation error |
<11-20 >4±0.15° |
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Electrical Parameters |
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Dopant |
n-type Nitrogen |
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Resistivity |
0.015-0.025ohm·cm |
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Mechanical Parameters |
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Diameter |
150.0±0.2mm |
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Thickness |
350±25 μm |
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Primary flat orientation |
[1-100]±5° |
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Primary flat length |
47.5±1.5mm |
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Secondary flat |
None |
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TTV |
≤5 μm |
≤10 μm |
≤15 μm |
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LTV |
≤3 μm(5mm*5mm) |
≤5 μm(5mm*5mm) |
≤10 μm(5mm*5mm) |
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Bow |
-15μm ~ 15μm |
-35μm ~ 35μm |
-45μm ~ 45μm |
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Warp |
≤35 μm |
≤45 μm |
≤55 μm |
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Front(Si-face) roughness(AFM) |
Ra≤0.2nm (5μm*5μm) |
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Structure |
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Micropipe density |
<1 ea/cm2 |
<10 ea/cm2 |
<15 ea/cm2 |
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Metal impurities |
≤5E10atoms/cm2 |
NA |
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BPD |
≤1500 ea/cm2 |
≤3000 ea/cm2 |
NA |
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TSD |
≤500 ea/cm2 |
≤1000 ea/cm2 |
NA |
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Front Quality |
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Front |
Si |
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Surface finish |
Si-face CMP |
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Particles |
≤60ea/wafer (size≥0.3μm) |
NA |
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Scratches |
≤5ea/mm. Cumulative length ≤Diameter |
Cumulative length≤2*Diameter |
NA |
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Orange peel/pits/stains/striations/ cracks/contamination |
None |
NA |
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Edge chips/indents/fracture/hex plates |
None |
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Polytype areas |
None |
Cumulative area≤20% |
Cumulative area≤30% |
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Front laser marking |
None |
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Back Quality |
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Back finish |
C-face CMP |
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Scratches |
≤5ea/mm,Cumulative length≤2*Diameter |
NA |
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Back defects (edge chips/indents) |
None |
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Back roughness |
Ra≤0.2nm (5μm*5μm) |
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Back laser marking |
1 mm (from top edge) |
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Edge |
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Edge |
Chamfer |
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Packaging |
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Packaging |
Epi-ready with vacuum packaging Multi-wafer cassette packaging |
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*Notes： "NA" means no request Items not mentioned may refer to SEMI-STD. |
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