Semicera introduces the Semiconductor Cassette, an essential tool for the secure and efficient handling of wafers throughout the semiconductor manufacturing process. Engineered with high precision, this cassette ensures that your wafers are safely stored and transported, maintaining their integrity at every stage.
Superior Protection and Durability The Semiconductor Cassette from Semicera is built to offer maximum protection to your wafers. Constructed from robust, contamination-resistant materials, it shields your wafers from potential damage and contamination, making it an ideal choice for cleanroom environments. The cassette's design minimizes particulate generation and ensures that wafers remain untouched and secure during handling and transportation.
Enhanced Design for Optimal Performance Semicera’s Semiconductor Cassette features a meticulously engineered design that provides precise wafer alignment, reducing the risk of misalignment and mechanical damage. The cassette’s slots are perfectly spaced to hold each wafer securely, preventing any movement that could result in scratches or other imperfections.
Versatility and Compatibility The Semiconductor Cassette is versatile and compatible with various wafer sizes, making it suitable for different stages of semiconductor fabrication. Whether you’re working with standard or custom wafer dimensions, this cassette adapts to your needs, offering flexibility in your manufacturing processes.
Streamlined Handling and Efficiency Designed with the user in mind, the Semicera Semiconductor Cassette is lightweight and easy to handle, allowing for quick and efficient loading and unloading. This ergonomic design not only saves time but also reduces the risk of human error, ensuring smooth operations within your facility.
Meeting Industry Standards Semicera ensures that the Semiconductor Cassette meets the highest industry standards for quality and reliability. Each cassette undergoes rigorous testing to guarantee that it performs consistently under the demanding conditions of semiconductor manufacturing. This dedication to quality ensures that your wafers are always protected, maintaining the high standards required in the industry.
Items |
Production |
Research |
Dummy |
Crystal Parameters |
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Polytype |
4H |
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Surface orientation error |
<11-20 >4±0.15° |
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Electrical Parameters |
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Dopant |
n-type Nitrogen |
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Resistivity |
0.015-0.025ohm·cm |
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Mechanical Parameters |
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Diameter |
150.0±0.2mm |
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Thickness |
350±25 μm |
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Primary flat orientation |
[1-100]±5° |
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Primary flat length |
47.5±1.5mm |
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Secondary flat |
None |
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TTV |
≤5 μm |
≤10 μm |
≤15 μm |
LTV |
≤3 μm(5mm*5mm) |
≤5 μm(5mm*5mm) |
≤10 μm(5mm*5mm) |
Bow |
-15μm ~ 15μm |
-35μm ~ 35μm |
-45μm ~ 45μm |
Warp |
≤35 μm |
≤45 μm |
≤55 μm |
Front(Si-face) roughness(AFM) |
Ra≤0.2nm (5μm*5μm) |
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Structure |
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Micropipe density |
<1 ea/cm2 |
<10 ea/cm2 |
<15 ea/cm2 |
Metal impurities |
≤5E10atoms/cm2 |
NA |
|
BPD |
≤1500 ea/cm2 |
≤3000 ea/cm2 |
NA |
TSD |
≤500 ea/cm2 |
≤1000 ea/cm2 |
NA |
Front Quality |
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Front |
Si |
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Surface finish |
Si-face CMP |
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Particles |
≤60ea/wafer (size≥0.3μm) |
NA |
|
Scratches |
≤5ea/mm. Cumulative length ≤Diameter |
Cumulative length≤2*Diameter |
NA |
Orange peel/pits/stains/striations/ cracks/contamination |
None |
NA |
|
Edge chips/indents/fracture/hex plates |
None |
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Polytype areas |
None |
Cumulative area≤20% |
Cumulative area≤30% |
Front laser marking |
None |
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Back Quality |
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Back finish |
C-face CMP |
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Scratches |
≤5ea/mm,Cumulative length≤2*Diameter |
NA |
|
Back defects (edge chips/indents) |
None |
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Back roughness |
Ra≤0.2nm (5μm*5μm) |
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Back laser marking |
1 mm (from top edge) |
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Edge |
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Edge |
Chamfer |
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Packaging |
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Packaging |
Epi-ready with vacuum packaging Multi-wafer cassette packaging |
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*Notes: "NA" means no request Items not mentioned may refer to SEMI-STD. |