Semiconductor Cassette

Short Description:

Semiconductor Cassette – Protect and transport your wafers with precision using Semicera’s Semiconductor Cassette, designed to ensure optimal safety and efficiency in high-tech manufacturing environments.


Product Detail

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Semicera introduces the Semiconductor Cassette, an essential tool for the secure and efficient handling of wafers throughout the semiconductor manufacturing process. Engineered with high precision, this cassette ensures that your wafers are safely stored and transported, maintaining their integrity at every stage.

Superior Protection and Durability The Semiconductor Cassette from Semicera is built to offer maximum protection to your wafers. Constructed from robust, contamination-resistant materials, it shields your wafers from potential damage and contamination, making it an ideal choice for cleanroom environments. The cassette's design minimizes particulate generation and ensures that wafers remain untouched and secure during handling and transportation.

Enhanced Design for Optimal Performance Semicera’s Semiconductor Cassette features a meticulously engineered design that provides precise wafer alignment, reducing the risk of misalignment and mechanical damage. The cassette’s slots are perfectly spaced to hold each wafer securely, preventing any movement that could result in scratches or other imperfections.

Versatility and Compatibility The Semiconductor Cassette is versatile and compatible with various wafer sizes, making it suitable for different stages of semiconductor fabrication. Whether you’re working with standard or custom wafer dimensions, this cassette adapts to your needs, offering flexibility in your manufacturing processes.

Streamlined Handling and Efficiency Designed with the user in mind, the Semicera Semiconductor Cassette is lightweight and easy to handle, allowing for quick and efficient loading and unloading. This ergonomic design not only saves time but also reduces the risk of human error, ensuring smooth operations within your facility.

Meeting Industry Standards Semicera ensures that the Semiconductor Cassette meets the highest industry standards for quality and reliability. Each cassette undergoes rigorous testing to guarantee that it performs consistently under the demanding conditions of semiconductor manufacturing. This dedication to quality ensures that your wafers are always protected, maintaining the high standards required in the industry.

Items

Production

Research

Dummy

Crystal Parameters

Polytype

4H

Surface orientation error

<11-20 >4±0.15°

Electrical Parameters

Dopant

n-type Nitrogen

Resistivity

0.015-0.025ohm·cm

Mechanical Parameters

Diameter

150.0±0.2mm

Thickness

350±25 μm

Primary flat orientation

[1-100]±5°

Primary flat length

47.5±1.5mm

Secondary flat

None

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Bow

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Front(Si-face) roughness(AFM)

Ra≤0.2nm (5μm*5μm)

Structure

Micropipe density

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Metal impurities

≤5E10atoms/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Front Quality

Front

Si

Surface finish

Si-face CMP

Particles

≤60ea/wafer (size≥0.3μm)

NA

Scratches

≤5ea/mm. Cumulative length ≤Diameter

Cumulative length≤2*Diameter

NA

Orange peel/pits/stains/striations/ cracks/contamination

None

NA

Edge chips/indents/fracture/hex plates

None

Polytype areas

None

Cumulative area≤20%

Cumulative area≤30%

Front laser marking

None

Back Quality

Back finish

C-face CMP

Scratches

≤5ea/mm,Cumulative length≤2*Diameter

NA

Back defects (edge chips/indents)

None

Back roughness

Ra≤0.2nm (5μm*5μm)

Back laser marking

1 mm (from top edge)

Edge

Edge

Chamfer

Packaging

Packaging

Epi-ready with vacuum packaging

Multi-wafer cassette packaging

*Notes: "NA" means no request Items not mentioned may refer to SEMI-STD.

tech_1_2_size
SiC wafers

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