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SiC Coating Wheel Gear: Enhancing Semiconductor Manufacturing Efficiency
In the rapidly advancing field of semiconductor manufacturing, precision and durability of equipment are paramount to achieving high yields and quality. One of the key components ensuring this is the SiC Coating Wheel Gear, designed to improve the efficiency of processes...Read more -
What is a Quartz Protection Tube? | Semicera
The quartz protection tube is an essential component in various industrial applications, known for its excellent performance in extreme conditions. At Semicera, we produce quartz protection tubes that are designed for high durability and reliability in harsh environments. With outstanding charact...Read more -
What is CVD Coated Process Tube? | Semicera
A CVD coated process tube is a critical component used in various high-temperature and high-purity manufacturing environments, such as semiconductor and photovoltaic production. At Semicera, we specialize in producing high-quality CVD coated process tubes that offer supe...Read more -
What is Isostatic Graphite? | Semicera
Isostatic graphite, also known as isostatically formed graphite, refers to a method where a mixture of raw materials is compressed into rectangular or round blocks in a system called cold isostatic pressing (CIP). Cold isostatic pressing is a material processing method i...Read more -
What is Tantalum Carbide? | Semicera
Tantalum carbide is an extremely hard ceramic material known for its exceptional properties, particularly in high-temperature environments. At Semicera, we specialize in providing top-quality tantalum carbide that offers superior performance in industries requiring advanced materials for extreme ...Read more -
What is a Quartz Furnace Core Tube? | Semicera
A quartz furnace core tube is an essential component in various high-temperature processing environments, widely used in industries like semiconductor manufacturing, metallurgy, and chemical processing. At Semicera, we specialize in producing high-quality quartz furnace core tubes that are known ...Read more -
Dry Etching Process
Dry etching process usually consists of four basic states: before etching, partial etching, just etching, and over etching. The main characteristics are etching rate, selectivity, critical dimension, uniformity, and endpoint detection. Figure 1 Before etching Figure 2 Partial etching Figur...Read more -
SiC Paddle in Semiconductor Manufacturing
In the realm of semiconductor manufacturing, the SiC Paddle plays a crucial role, particularly in the epitaxial growth process. As a key component used in MOCVD (Metal Organic Chemical Vapor Deposition) systems, SiC Paddles are engineered to endure high temperatures and ...Read more -
What is Wafer Paddle? | Semicera
A wafer paddle is a crucial component used in the semiconductor and photovoltaic industries to handle wafers during high-temperature processes. At Semicera, we take pride in our advanced capabilities to produce top-quality wafer paddles that meet the rigorous demands of...Read more -
Semiconductor Process and Equipment(7/7)- Thin Film Growth Process and Equipment
1. Introduction The process of attaching substances (raw materials) to the surface of substrate materials by physical or chemical methods is called thin film growth.According to different working principles, integrated circuit thin film deposition can be divided into:-Physical Vapor Deposition (P...Read more -
Semiconductor Process and Equipment(6/7)- Ion Implantation Process and Equipment
1. Introduction Ion implantation is one of the main processes in integrated circuit manufacturing. It refers to the process of accelerating an ion beam to a certain energy (generally in the range of keV to MeV) and then injecting it into the surface of a solid material to change the physical prop...Read more -
Semiconductor Process and Equipment(5/7)- Etching Process and Equipment
One Introduction Etching in the integrated circuit manufacturing process is divided into:-Wet etching;-Dry etching. In the early days, wet etching was widely used, but due to its limitations in line width control and etching directionality, most processes after 3μm use dry etching. Wet etching is...Read more