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What is Porous Graphite?
Porous graphite revolutionizes SiC crystal growth by improving yield, reducing defects, and lowering production costs. Introduction: Porous graphite, also known as porous carbon or porous graphite materials, is a specially designed form of graphite featuring interconnec...Read more -
Why Semiconductor Devices Require an “Epitaxial Layer”
Origin of the Name “Epitaxial Wafer” Wafer preparation consists of two main steps: substrate preparation and epitaxial process. The substrate is made of semiconductor single crystal material and is typically processed to produce semiconductor devices. It can also undergo epitaxial pro...Read more -
What is Silicon Nitride Ceramics?
Silicon nitride (Si₃N₄) ceramics, as advanced structural ceramics, possess excellent properties such as high temperature resistance, high strength, high toughness, high hardness, creep resistance, oxidation resistance, and wear resistance. Additionally, they offer good t...Read more -
SK Siltron receives $544 million loan from DOE to expand silicon carbide wafer production
The U.S. Department of Energy (DOE) recently approved a $544 million loan (including $481.5 million in principal and $62.5 million in interest) to SK Siltron, a semiconductor wafer manufacturer under SK Group, to support its expansion of high-quality silicon carbide (SiC...Read more -
What is ALD system(Atomic Layer Deposition)
Semicera ALD Susceptors: Enabling Atomic Layer Deposition with Precision and Reliability Atomic Layer Deposition (ALD) is a cutting-edge technique that offers atomic-scale precision for depositing thin films in various high-tech industries, including electronics, energy,...Read more -
Semicera Hosts Visit from Japanese LED Industry Client to Showcase Production Line
Semicera is pleased to announce that we recently welcomed a delegation from a leading Japanese LED manufacturer for a tour of our production line. This visit highlights the growing partnership between Semicera and the LED industry, as we continue to provide high-quality,...Read more -
Front End of Line (FEOL): Laying the Foundation
The front, middle and back ends of semiconductor manufacturing production lines The semiconductor manufacturing process can be roughly divided into three stages:1) Front end of line2) Mid end of line3) Back end of line We can use a simple analogy like building a house to explore the complex proc...Read more -
A brief discussion on the photoresist coating process
The coating methods of photoresist are generally divided into spin coating, dip coating and roll coating, among which spin coating is the most commonly used. By spin coating, photoresist is dripped on the substrate, and the substrate can be rotated at high speed to obtai...Read more -
Photoresist: core material with high barriers to entry for semiconductors
Photoresist is currently widely used in the processing and production of fine graphic circuits in the optoelectronic information industry. The cost of the photolithography process accounts for about 35% of the entire chip manufacturing process, and the time consumption accounts for 40% to 60...Read more -
Wafer surface contamination and its detection method
The cleanliness of the wafer surface will greatly affect the qualification rate of subsequent semiconductor processes and products. Up to 50% of all yield losses are caused by wafer surface contamination. Objects that can cause uncontrolled changes in the electrical perf...Read more -
Research on semiconductor die bonding process and equipment
Study on semiconductor die bonding process, including adhesive bonding process, eutectic bonding process, soft solder bonding process, silver sintering bonding process, hot pressing bonding process, flip chip bonding process. The types and important technical indicators ...Read more -
Learn about through silicon via (TSV) and through glass via (TGV) technology in one article
Packaging technology is one of the most important processes in the semiconductor industry. According to the shape of the package, it can be divided into socket package, surface mount package, BGA package, chip size package (CSP), single chip module package (SCM, the gap between the wiring on the ...Read more