Isostatic PECVD Graphite Boat

Short Description:

Isostatic PECVD graphite boat is widely used in various links of semiconductor manufacturing, such as polysilicon film deposition, oxide film deposition, nitride film deposition, etc. Its excellent performance makes it an ideal wafer carrier in the PECVD process.

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SEMICERA isostatic PECVD graphite boat is a high-purity, high-density graphite product designed for wafer support in the PECVD (plasma enhanced chemical vapor deposition) process. SEMICERA uses advanced isostatic pressing technology to ensure that the graphite boat has excellent high temperature resistance, corrosion resistance, dimensional stability and good thermal conductivity, which is an indispensable consumable in the semiconductor manufacturing process.

SEMICERA isostatic PECVD graphite boat has the following advantages:

▪ High purity: The graphite material is of high purity and low impurity content to avoid contamination of the wafer surface.

▪ High density: High density, high mechanical strength, can withstand high temperature and high vacuum environment.

▪ Good dimensional stability: Small dimensional change at high temperature to ensure process stability.

▪ Excellent thermal conductivity: Effectively transfer heat to prevent wafer overheating.

▪ Strong corrosion resistance: Able to resist erosion by various corrosive gases and plasma.

Performance parameter	semicera	SGL R6510	Performance parameter
Bulk density (g/cm3)	1.91	1.83	1.85
Bending strength (MPa)	63	60	49
Compressive strength (MPa)	135	130	103
Shore Hardness (HS)	70	64	60
Coefficient of thermal expansion（10-6/K）	85	105	130
Coefficient of thermal expansion（10-6/K）	5.85	4.2	5.0
Resistivity (μΩm)	11-13	13	10

Advantages of choosing us:
▪  Material selection: High-purity graphite materials are used to ensure product quality.
▪  Processing technology: Isostatic pressing is used to ensure product density and uniformity.
▪  Size customization: Graphite boats of different sizes and shapes can be customized according to customer needs.
▪  Surface treatment: A variety of surface treatment methods are provided, such as coating silicon carbide, boron nitride, etc., to meet different process requirements.