Float Zone Wafer is grown by floating Zone melting method (Float Zone melting method), also known as zone melting wafer, FZ wafer, is a high-purity silicon wafer, can replace the CZ single crystal straight-drawn process of silicon wafers. Compared to wafers manufactured using the CZ method, zoned wafers have many advantages, such as no crucible, low production load, and no melting point limitation, making them ideal for applications such as solar modules, RF devices, and precision power devices. The concentration of oxygen and carbon impurities in FZ wafers is low, and nitrogen is specially added to improve its mechanical strength.
Item | Argument | Sample inquiry |
Quantity: |
|
100pcs |
Growth Method: |
Float Zone |
FZ |
Diameter: |
50/75/100/150/200/300mm |
100mm |
Type/Dopant: |
P-Type / N-Type / Intrinsic |
N-Type |
Orientation: |
<1-0-0>/<1-1-0>/<1-1-1>或其它 |
<100> |
Resistivity: |
100~30,000 ohm-cm |
3000 ohm-cm |
Thickness: |
275 um ~ 775 um |
500um |
Finish: |
SSP/DSP |
DSP |
Flats: |
Notch/Two SEMI Standard Flats |
Notch |
BOW/WARP: |
<10 µm |
<40um |
TTV: |
<5 µm |
<20um |
Grade: |
Prime / Test / Dummy |
Prime |